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Silicon Nitride Structural Parts

APPLICATION
1.Super hard and wear resistant.
2.High and low temperature resistance.
3.Corrosion resistance.
4.Non-magnetic electrical insulation.
5.High thermal conductivity and low expansion coefficient.

Main Technologies and Parameters of I-TOWU Silicon Nitride Ceramics

Density g/cm³relative density(%)modulus of elasticty GPaCrushing load ratio (%)Hardness(HV) GPa
3.20±0.05>99.5300-320≥40≥14.2
Breaking tencity Mpa.Mthree-point bending
strength Mpa
Poisson ratioCoefficient of linear expansionWeibull modulus
strength Mpa
6.0-7.0≥8200.253.0-3.210-12
Thermal conductivity
w/(M-K)
Specific resistivity(cm)Acid and comosion
Resistance
dimensional stablityMagnetic
15-2010(18方)excellentexcellentNONE

*Main technology: Cold isostatic pressing(CIP) molding air pressure(GPS) sintering

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